Application Fields:

Dual-interface finance, payment, and security products.

Features and Advantages:

Through ingenious design and refined manufacturing processes, this innovative solution applies the electromagnetic coupling effect to the smart card field. It simplifies the complex dual-interface card manufacturing process into a streamlined procedure comparable to that of ordinary SIM cards. The product's card manufacturing process is straightforward, enhancing production efficiency and product yield while being more environmentally friendly. The improvements in efficiency and cost reduction will deliver significant benefits to customers.

Note: Both blind vias and through-holes can currently be processed, and 35μm copper foil can be used to create 75/75μm coils.