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About HENGHUI

About HENGHUI

HENGHUI Technology

HENGHUI Technology Corporation limited (hereinafter referred to as 'the Company') was established in December 2017. It is an integrated circuit enterprise that combines R&D, production, sales, and packaging testing services for chip packaging materials. The Company's main business includes smart card , etched leadframe , and Internet of Things (IoT) eSIM chip packaging and testing.

The smart card business primarily involves the R&D, production, and sales of flexible leadframe products for smart card chip packaging. The company provides smart card modules or module packaging services to customers, mainly relying on its own flexible leadframe products. These products are widely applied in telecommunications, finance, transportation, and identity recognition fields.

In the areas of etched leadframes and IoT eSIM chip packaging and testing, the Company has invested substantial human and material resources in recent years to tackle technical challenges. It has successfully mastered several core technologies, including roll-to-roll laser direct-write exposure technology, roll-to-roll continuous etching technology, and high-precision selective electroplating technology,which has achieved mass production and sales,and have gradually become new growth drivers for the company.

The Company is committed to independent research、development and product innovation. It has established the Shandong Province Enterprise Technology Center and built four industry-leading laboratories for physicochemical analysis, reliability testing, failure analysis, and smart card verification. The company has accumulated key core technologies related to high-precision patterning of metal material surfaces and metal surface treatments.

The Company has a high-level R&D team that provides strong support for the rapid development of new products. This team continuously reserves and develops technology for basic materials, key processes, and future new product designs, provides sustained momentum for the long-term development of enterprises.

Cultures

Cultures

Talent Philosophy

We respect value, 

put people first,

and empower every individual to reach their full potential.



Corporate Vision

To provide our shareholders, clients, and employees 

the opportunity to create and realize their aspirations, 

and to become a world-class leader in the integrated circuit industry.



Core Values

Entrepreneurship & Innovation

We pursue innovations that matters most to our clients and our company, 

and we implement it with speed and efficiency.



Business Philosophy

Drive Innovate

Continuously create value for our clients.

Strive for Excellence

Dedicate ourselves to the advancement of the integrated circuit industry.


ONE-STOP SERVICE

ONE-STOP SERVICE

One-Stop IC Solutions: From Wafer to Test.

ONE-STOP SERVICE

  • Flexible Leadframe

    Flexible Leadframe

    HENGHUI has mastered the core technologies for high-precision pattern etching and complex metal surface treatment on metal surface. It can provide high-degree customization according to customer requirements. The designed and manufactured flexible lead frames are widely used in telecommunications, finance, payment, and other public fields.

  • Etched Leadframe

    Etched Leadframe

    Leveraging the technical accumulation of traditional flexible lead frames, HENGHUI has independently developed core technologies such as roll-to-roll mask-less Laser Direct Writing Lithography, roll-to-roll continuous etching, and high-precision selective electroplating, which have effectively improved the product quality and production efficiency of etched lead frames.

  • Smart Card Module Assembly

    Smart Card Module Assembly

    HENGHUI has more than 100 professional module packaging and testing equipment, which can provide customers with services such as die bonding, wire bonding, potting, and electrical testing. It has passed CC EAL6+ certification and has the processing capacity and qualifications for high-security chip products.

  • eSIM Assembly

    eSIM Assembly

    HENGHUI has a variety of wafer thinning, dicing, packaging, and testing equipment. Relying on self-developed and self-produced packaging materials, it provides customers with one-stop services from wafer processing to IoT eSIM chip packaging and testing, greatly shortening the production cycle and product delivery time.

Global Coverage

Global Coverage

Our business reaches over 20 countries and regions across four continents including Asia and Europe; Our customers include well-known domestic and foreign chip design companies and global card issuers. The market share of flexible lead frames and smart card module products steadily ranks among the top two globally.

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